PAG Vision 2035 · Specialized Polymeric Materials

Advanced Polymer Engineering for the Next Generation

A specialty chemicals manufacturer engineering polyimide and polyurethane resins for semiconductors, next-generation displays, and sustainable mobility.

APEON Advanced Materials R&D Center
THERMAL LIMIT
350°C+
Thermal stability (Imide series)
RELIABILITY
260°C
Reflow simulator evaluation
COMPLIANCE
100%
PFAS-free design · RoHS aligned
QUALITY SYSTEM
2
Corporate R&D Lab · Venture Business
01 — Company

Localizing high-performance chemical materials for global advanced industries.

APEON — Advanced Polymer Engineering for the Next generation — is advancing cooperative vertical integration from base polymer synthesis to high-performance film formulation. We engineer polyimide and polyurethane platforms toward scalable supply and import substitution in semiconductor packaging, flexible displays, and EV batteries.

CORE LOCALIZATION CHEMISTRYBy precisely engineering imide rings and urethane segments, we successfully produce domestic high-heat resins that replace imported grades.
02 — Technology

An R&D platform engineered for extreme conditions.

View Instrumentation & R&D
High Heat Control

Polyimide & TPI

Solvent-soluble thermoplastic polyimide varnish enabling low-temperature fusion bonding within sub-300°C process windows.

TECHNOLOGY #1
Antistatic (ESD-Safe)

Polyurethane & Antistatic (ESD-Safe)

Surface-resistivity controlled antistatic coating resins (10⁶–10⁹ Ω/sq) for cleanroom wafer and device transport carriers.

TECHNOLOGY #2
260°C Reflow Qualified

Segmented Copolymer Design

Hybrid imide-urethane segmented copolymer architectures qualified for repeated 260°C lead-free solder reflow cycles.

TECHNOLOGY #3
PFAS-Free Green

Green Chemistry

Biomass-derived raw materials and 100% PFAS-free battery binder systems.

TECHNOLOGY #4
03 — Products

Two resin platforms. Engineered for industry.

Flexible PCB and battery application
TARGET APPLICATION: ACF / FPCB
APC-1000 / 6000 Series

Special Urethane Resin

URETHANE

High flexibility, excellent tackiness, and optimized formulations engineered for next-generation flexible electronics, including FPCB lamination and low-temperature ACF bonding.

APPLICATIONS
  • ACF fast-cure reactive binders
  • Flexible PCB (FPCB) low-stress adhesives
  • Waterborne PFAS-Free EV battery binders
View Urethane Spec SheetsAPC-1000 / APC-6000
Semiconductor packaging application
TARGET APPLICATION: QFN / SEMICONDUCTOR
APC-4000 Series

Special Imide Resin

IMIDE / HYBRID

Hybrid imide-urethane resins with high thermal stability (Td > 350°C) for QFN lamination, repeated 260°C lead-free reflow, and printed coverlay applications.

APPLICATIONS
  • QFN semiconductor packaging and high-heat adhesives
  • Screen-printable Polyimide Coverlay (PLC)
  • Thermoplastic LFB low-temp fast varnish
View Imide Spec SheetsAPC-4000 Series
05 — Contact

Speak with our R&D team.

For sample requests and collaborative R&D proposals regarding APEON's high-performance chemical materials, feel free to contact us. We respond promptly with custom molecular synthesis support.

Sample Requests

Specify molecular weight target, solids percentage, viscosity windows, and Tg to receive a 1L test batch from our Daejeon R&D center.

Joint Research & Dev

Joint copolymer synthesis and custom formulation under NDAs to resolve thermal and chemical reliability limits in packaging and FPCB applications.

Headquarters & R&D Center · Daejeon

309, Science Park, 1646, Yuseong-daero, Yuseong-gu, Daejeon

Tel: +82 (0)42-716-0062
Inquiry