Advanced Polymer Engineering for the Next Generation
A specialty chemicals manufacturer engineering polyimide and polyurethane resins for semiconductors, next-generation displays, and sustainable mobility.
High-performance chemical materials, engineered in Korea for global advanced industries.
APEON — Advanced Polymer Engineering for the Next Generation — is advancing cooperative vertical-integration from base polymer synthesis to high-performance film formulation. We engineer polyimide and polyurethane platforms to seamlessly integrate the value chain from core raw materials to finished specialty materials, expanding added value.
An R&D platform engineered for extreme conditions.
Polyimide & TPI Synthesis
A synthesis and research platform for soluble imide and TPI systems delivering solution processability and sub-300°C melt flowability.
Polyurethane Precision Synthesis
Core technology for synthesizing high-performance polyurethanes through precise reaction design of polyols and isocyanates.
Segmented Copolymer Design
A technology combining the heat resistance of imide segments with the stress-relaxing structure of urethane via segmented block copolymerization, suppressing interfacial delamination during 260°C lead-free solder reflow.
Green Chemistry
Exploratory R&D on high-elasticity waterborne binders that control silicon anode expansion, maximizing cycle life and eco-friendliness through aqueous, organic-solvent-free formulation.
High-performance polymers, engineered for industry.
Specialty Urethane Resin
High flexibility, excellent tack, and optimized formulations engineered for next-generation flexible electronics, including FPCB lamination and low-temperature ACF bonding.
- ACF fast-cure reactive binders
- Flexible PCB (FPCB) low-stress adhesives
- Specialty polymer binders for silicon anodes
Specialty Imide Resin
Acrylate-terminated imide-urethane hybrids combining high thermal stability with strong interfacial adhesion — engineered for QFN packaging, reflow-grade bonding, and low-temperature lamination.
- QFN semiconductor packaging and high-heat adhesives
- Screen-printable Polyimide Coverlay (PLC)
- Thermoplastic LFB (low-temp fast bonding) varnish
Speak with our R&D and Business teams.
We are open to sample requests and R&D collaboration proposals regarding APEON's high-performance chemical materials. We support customized materials for your successful product development.
Sample Requests
Specify molecular weight target, solids content (wt%), viscosity range, and Tg to receive a 1L test batch from our Daejeon R&D center.
Joint R&D
Joint copolymer synthesis and custom formulation under NDAs to resolve thermal and chemical reliability limits in packaging and FPCB applications.
Headquarters & R&D Center · Daejeon
Room 309, Science Park, 1646 Yuseong-daero, Yuseong-gu, Daejeon
