R&D Tech Capability & Lab Infrastructure
APEON integrates precision molecular design, chemical reaction profiling, and advanced material analysis to localize high-value polymers for semiconductors, flexible displays, and 5G/6G communication systems. Our PhD researchers lead the entire process from computer molecular modeling to pilot-scale engineering.
1. Next-Generation R&D Initiatives
Display Materials R&D
Forward-looking molecular design for ultra-high-resolution displays and high-density 6G module substrates.
A. Self-Assembly ACF Binder
Nano-phase separated polymer networks prompting conductive balls to spontaneously migrate to terminal micro-electrodes, securing conduction while preventing pixel shorting as pitches fall under 10µm.
B. [Pre-R&D] Next-Gen 5G/6G High-Frequency Low-Loss Resin
[Pre-R&D] Molecular design of porous fluorinated PI and MPI targeting dielectric loss (Df) ~0.001 for mmWave bands.
Semiconductor & EV Materials R&D
High-heat polymer engineering addressing high-density semiconductor stacking and EV battery insulation.
A. [Pre-R&D] HBM Hybrid Stacking Materials
Pre-study on solvent-free imide-epoxy copolymer systems to prevent micro-voids in 3D stacked memory, alongside photosensitive polyimide (PSPI) base molecular design.
B. EV Battery & Power Module Resin
Thermally conductive polyurethane/imide hybrid binders that meet high-voltage insulation requirements while dissipating heat and preserving long-term adhesion to metal casings, contributing to thermal runaway risk mitigation.
2. Core Polymer Synthesis Platforms
Polyimide & TPI Synthesis
PAA/PAE precursor synthesis leveraging monomer steric characteristics. Segmented copolymerization creates thermoplastic polyimide (TPI) varnish that bonds under sub-300°C process windows while retaining thermal stability (neat TPI: Td > 400°C).
Polyurethane & Antistatic (ESD-Safe) Formulation
Elastomer mechanics tailored via polyol backbone selection and NCO/OH index control. Surface resistivity is fine-tuned to antistatic windows (10^6 ~ 10^9 Ω/sq) for cleanroom wafer/device transport carrier resins.
Imide-Urethane Segmented Copolymers
Segmented copolymerization linking highly rigid imide rings with flexible urethane segments in a single backbone. The resulting Polyurethane-imide (PUIA) adhesives are engineered to withstand 260°C lead-free reflow stress.
Eco-friendly Green Chemistry
Introduction of plant-based bio-polyol raw materials to reduce Carbon Footprint. Pre-R&D of precision waterborne synthesis for 100% PFAS-free lithium-ion battery binders — replacing PVDF/NMP systems in cathodes and outperforming conventional aqueous binders in anodes.
Functional Groups & LFB Control
Introducing reactive sites (epoxy, carboxyl, acrylate) into polymer chains. End-capping agents regulate network density, enabling low-temperature fast bonding (LFB) and zero-residue peel release.
Scale-up & Process Engineering
Scaling lab formulations (1L) up to pilot (50L) and mass-production reactors (1,000L). Reaction kinetics and reactor heat-transfer control minimize lot-to-lot variability.
3. Instrumentation & Lab Capabilities
Chemical Structure & Chromatography
- GPC/SEC (Gel Permeation Chromatography)Measures molecular weight distribution (Mn, Mw, PDI) to control resin consistency.
- FT-IR (Infrared Spectrometer)Tracks imidization conversion and quantifies residual acrylate functional groups after cure.
- Karl Fischer (Moisture Analyzer)Detects micro moisture levels (ppm) that cause void defects during laminating.
Thermal & Rheological Analysis
- DMA (Dynamic Mechanical Analyzer)Measures storage and loss moduli (E′/E″ or G′/G″) versus temperature for film viscoelastic and thermal stress-relaxation analysis.
- DSC (Differential Scanning Calorimeter)Measures glass transition temperature (Tg) and profiles polymerization curing kinetics.
- TGA (Thermogravimetric Analyzer)Determines 5% weight loss decomposition temperature (Td5%) under nitrogen/air.
Adhesion & Reliability Testing
- UTM (Universal Testing Machine)Measures 90°/180° peel strength, tensile properties, and die shear parameters.
- Climate Reliability ChamberExposes specimens to 85°C/85% RH for up to 1,000 hours to evaluate moisture resilience.
- Reflow SimulatorSimulates repeated 260°C lead-free solder reflow to check for delamination and thermal/outgassing voids.
4. Commercial Success & Import Substitution
Display Anisotropic Conductive Film (ACF) Binder
Developed polyurethane-imide binders for fine-pitch driver IC packaging (ACF). Line evaluation and NPI supply ongoing with global display customers.
FPCB High-Heat Lamination Adhesives (Import Substitution)
In-house synthesized high-temperature polyurethane adhesives for flexible copper-clad laminates (FCCL) and shielding films, replacing imported grades and securing domestic supply chains.
5G High-Frequency Low-Loss (Low Dk/Df) Adhesives
Engineered modified polyimides incorporating bulky, low-polarity units. Successfully minimized dielectric loss (Dk/Df) under 28GHz bands, establishing supply references for mobile flagship devices.
5. Intellectual Property & Patents
Patent: (Meth) acrylate-terminated polyurethane (amide) imide adhesive resin, manufacturing method and use thereof
Proprietary formulation patent combining rigid imide ring structures with urethane elastomer segments, capped with acrylate sites for radical curing.
Patent: Low dielectric polyamideimide-based adhesive resin, manufacturing method and use thereof
Formulation patents focusing on Soluble PAI utilizing alicyclic and fluorinated functional blocks to decrease packing density, resulting in low dielectric constants (Dk/Df).
Patent: Polyamideimide resin for semiconductor package, manufacturing method and QFN adhesive film
Patented synthetic pathway incorporating silicone soft domains into the PAI matrix to relieve thermal stress, suppress package warpage, and prevent interfacial delamination during 260°C reflow, designed for QFN leadframes.
