03 — Products

High-Performance Resin Catalog

Polyurethane Product
APC-1000 / 6000 Series

Special Urethane Resin

High flexibility, excellent tackiness, and optimized formulations engineered for next-generation flexible electronics, including FPCB lamination and low-temperature ACF bonding.

Polyurethane Repeating Unit
OCONHCH₂NHCOOPolyol (Soft Segment)n

Chemistry of ACF & Polyurethane Binder Systems

Anisotropic Conductive Film (ACF) is the standard material connecting driver IC micro-electrodes to glass panels.
1) Thermocompression Flow Stage: Under thermocompression bonding pressure, the polyurethane binder undergoes rapid viscous flow to fill microscopic wire gaps. Storage modulus (G') control is vital to ensure optimal conductive particle capture and alignment.
2) Curing & Sealing Stage: Rapid crosslinking of acrylate end-groups forms a 3D network locking the conductive particles in place. The cured elastomer absorbs mechanical shear and shields the circuit from environmental humidity and oxygen, suppressing electrode corrosion.

A. Reactive Urethane-Acrylate Lineup

Excellent radical curing rates and adjustable crosslinking density, ideal for fast-cure ACF formulation and hybrid UV/thermal coatings.

GradeSolid (wt%)Viscosity (cP/25°C)Diluent SolventAcrylate FunctionalityTg (°C)Flowability (80°C)Key Properties & Application
APC-100065.0 ± 2.06,000 ± 3,000EA / BA230High flow, ultra fast radical curing, for low-temperature ACF formulations.
APC-110157.0 ± 2.018,000 ± 7,200EA / BA235Standard ACF base resin, perfect balance of peel strength and flow parameters.
APC-110258.0 ± 2.013,000 ± 5,200EA / BA125High flexibility and flow profile, optimized for thin display modules.
APC-110556.0 ± 2.012,000 ± 3,000EA / BA245Strong initial tackiness and boundary adhesion, perfect for moisture reliability.
APC-115050.0 ± 2.07,000 ± 2,000EA / BA290△ ~ XHigh hardness and high Tg specialty grade with excellent heat resistance.
APC-220160.0 ± 2.05,000 ± 2,000MEK / BA260Ultra-high flow, designed to maximize conductive particle trapping rates.
APC-130157.0 ± 2.013,000 ± 4,000EA / BA250○ ~ △Tough mechanical properties, good compatibilities, for high-reliability ACF.
APC-130362.0 ± 2.05,000 ± 2,000EA/MEK/BA265High elasticity, low shrinkage during curing, suitable for hard coatings.

B. Non-Reactive Urethane Polymer Lineup

Utilizes high molecular weight chains to aid film formation, providing elastomeric behavior and outstanding bending reliability.

GradeSolid (wt%)Viscosity (cP/25°C)Diluent SolventTerminal GroupTg (°C)Flowability (80°C)Key Properties & Application
APC-600040.0 ± 2.09,000 ± 3,000EA / BA-10Lamination adhesive for flex circuits, stress absorption, high flexibility.
APC-610030.0 ± 2.07,000 ± 2,000EA / BA--5Low Tg grade for extreme low-temperature flex circuits and automotive sensors.
APC-620030.0 ± 2.014,000 ± 5,000PGMEA-35△ ~ XHeat resistant adhesive, strong bond with PI and PAI coated substrates.
APC-630040.0 ± 2.01,000 ± 500MEK / BA-40Low viscosity, high tackiness, suitable for thin layer coat formulations.
APC-640032.0 ± 2.01,600 ± 600MEK / BACarboxyl / Hydroxyl45△ ~ XCarboxyl/Hydroxyl-terminated, crosslinkable with isocyanates for strong bonds.

* Flowability symbols: ◎ (Excellent), ○ (Good), △ (Moderate/Low), X (None/Film-fixed) | Solvent abbreviations: EA (Ethyl Acetate), BA (Butyl Acetate), MEK (Methyl Ethyl Ketone), PGMEA (Propylene Glycol Monomethyl Ether Acetate)

Urethane Customization Design Parameters

1. Polyol Backbones Selection

Polycarbonate diol backbone is selected for water resistance and ultimate tensile strengths. Polyether glycol backbones are chosen for soft properties and extreme low-temperature flexibility.

2. Antistatic & ESD-Safe Formulation

Antistatic resins for wafer and device carrier coatings, with chemically incorporated non-ionic antistats that maintain transparency and adhesion while controlling surface resistivity (10⁶–10⁹ Ω/sq).

3. PFAS-Free Battery Binders

To proactively align with global PFAS regulations, we develop 100% PFAS-free (not-intentionally-added basis) waterborne polyurethane battery binder synthesis technologies. We are conducting pre-evaluation and sample tuning to replace PVDF/NMP systems in cathodes and optimize adhesion and flexibility for anodes.

One-Stop Custom Synthesis R&D Process

Step 01

Spec Meeting

Analyze targets

Step 02

Structure Design

Predict monomers

Step 03

Lab Synthesis

NMR/GPC checks

Step 04

Pilot Scale-up

Verify yield

Step 05

Client Testing

Reflow validation

Step 06

Mass Production

OEM partner mass production