High-Performance Resin Catalog
Special Imide Resin
Hybrid imide-urethane resins with high thermal stability (Td > 350°C) for QFN lamination, repeated 260°C lead-free reflow, and printed coverlay applications.
QFN Packaging Adhesion Mechanism & High-Temperature Bonding
Leadframe-based QFN (Quad Flat No-lead) packages require highly reliable interfacial bonding between metal leadframes, silicon chips, and epoxy molding compounds.
1) Stress Relaxation & CTE Mismatch Buffering: During lead-free solder reflow (260°C peak), thermal cycles generate CTE mismatch stress between silicon dies and metal leadframes, causing package warpage and interface cracks.
2) Hybrid Copolymer Stress Relaxation: APEON's APC-4000 hybrid polyurethane-imide platform combines rigid aromatic imide segments (Td > 350°C; high Tg) with soft urethane domains that dynamically relax mechanical stress, yielding high reliability under repeated lead-free reflow profiles.
A. Hybrid Imide-Urethane-Acrylate Lineup
| Grade | Solid (wt%) | Viscosity (cP/25°C) | Diluent Solvent | Curing Functionality | Tg (cured, °C) | Flowability (80°C) | Key Properties & Application |
|---|---|---|---|---|---|---|---|
| APC-4100 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 55 | △ | General-purpose high heat adhesion, good balance of strength and imide ring reliability. |
| APC-4200 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 75 | △ | High Tg adhesive layer, superior anti-rebound properties for flexible laminates. |
| APC-4300 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 65 | △ | High adhesion for polar surfaces (glass/copper), suitable for display ACF binders. |
| APC-4310 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 90 | △ ~ X | Ultra-high heat resistance, micro fine-pitch COG bonding, high-frequency devices. |
| APC-4320 | 56.0 ± 2.0 | 2,000 ± 700 | MEK / PGMEA | Acryl | 105 | △ ~ X | QFN backside protection and packaging grade, designed to survive repeated 260°C reflow. |
Polyimide Precursor Classifications
A. Polyamic Acid (PAA) Varnish
Unconverted baseline precursor offering high molecular weights and strong mechanical parameters for general film coatings.
B. Polyamic Ester (PAE) Varnish
A molecular design technology with photosensitive groups (methacrylate) pre-bonded to the ester chain, conducting pre-R&D and custom tuning for negative-type PSPI base applications.
C. Soluble Polyimide (PI) & TPI Varnish
Pre-imidized soluble varnish in MEK/PGMEA. Ideal for low-temperature fusion bonding (150–200°C), eliminating in-situ imidization baking.
Polyimide Liquid Coverlay (PLC)
A resin design platform for screen-printable liquid coverlay (PLC) directly onto FPCB circuits, replacing traditional film lamination. We develop customized formulations targeting thinner layouts, anti-warpage, and high bending reliability.
Thermoplastic LFB Technology
Utilizes soluble TPI to bond interlayers under low heat (150°C-200°C) with high speed. Strict polydispersity control eliminates low-molecular weight oligomers, minimizing organic residue to below detection limits after peeling.
One-Stop Custom Synthesis R&D Process
Spec Meeting
Analyze targets
Structure Design
Predict monomers
Lab Synthesis
NMR/GPC checks
Pilot Scale-up
Verify yield
Client Testing
Reflow validation
Mass Production
OEM partner mass production
