High-Performance Resin Catalog
Specialty Imide Resin
Acrylate-terminated imide-urethane hybrids combining high thermal stability with strong interfacial adhesion — engineered for QFN packaging, reflow-grade bonding, and low-temperature lamination.
QFN Packaging Adhesion Mechanism & High-Temperature Bonding
Leadframe-based QFN (Quad Flat No-lead) packages require highly reliable interfacial bonding between metal leadframes, silicon chips, and epoxy molding compounds.
1) Stress Relaxation & CTE Mismatch Buffering: During lead-free solder reflow (260°C peak, reached only briefly — on the order of seconds), thermal cycles generate CTE mismatch stress between silicon dies and metal leadframes, causing package warpage and interface cracks.
2) Hybrid Copolymer Stress Relaxation: APC-4000 hybrid polyurethane-imide resins combine rigid aromatic imide segments (designed toward a Td5 target of 350°C+; high Tg) with soft urethane domains that dynamically relax mechanical stress — reflow reliability is verified on our reflow simulator under repeated lead-free profiles.
A. Hybrid Imide-Urethane-Acrylate Lineup
| Grade | Solid (wt%) | Viscosity (cP/25°C) | Diluent Solvent | Curing Functionality | Tg (cured, °C) | Flowability (80°C) | Key Properties & Application |
|---|---|---|---|---|---|---|---|
| APC-4100 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 55 | △ | General-purpose high-temperature adhesion, good balance of strength and imide ring reliability. |
| APC-4200 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 75 | △ | High Tg adhesive layer, superior anti-springback properties for flexible laminates. |
| APC-4300 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 65 | △ | High adhesion for polar surfaces (glass/metal), suitable for display ACF binders. |
| APC-4310 | 56.0 ± 2.0 | 1,500 ± 500 | MEK / PGMEA | Acryl | 90 | △ ~ X | Low-Dk/Df MPI adhesive for high-frequency (28 GHz) devices and fine-pitch COG bonding. |
| APC-4320 | 56.0 ± 2.0 | 2,000 ± 700 | MEK / PGMEA | Acryl | 105 | △ ~ X | QFN backside protection and packaging grade, designed to survive repeated 260°C reflow. |
Polyimide Precursor Classifications
Polyamic Acid (PAA) Varnish
Unconverted baseline precursor offering high molecular weights and robust mechanical properties for general film coatings.
Polyamic Ester (PAE) Varnish
Polyamic ester (PAE) precursors with photosensitive side-chain groups (e.g., methacrylate) for custom negative-type PSPI base formulations — tuning photoreactivity and development contrast.
Soluble Polyimide (PI) & TPI Varnish
Pre-imidized soluble varnish in MEK/PGMEA. Ideal for low-temperature fusion bonding (150–200°C), eliminating in-situ imidization baking.
FPCB Liquid Coverlay (PLC)
Screen-printable liquid coverlay (PLC) resins applied directly onto FPCB circuit traces — replacing PI film lamination. Formulations target thin coatings, anti-warpage, and high bending reliability.
Thermoplastic LFB (Low-temp Fast Bonding)
Utilizes soluble TPI to bond interlayers under low heat (150°C-200°C) with high speed. Tight Mn/Mw control (low PDI) minimizes low-MW fractions, reducing organic residue to below detection limits after peeling.
One-Stop Custom Synthesis R&D Process
Spec Meeting
Receive property requirements
Structure Design
Predict monomer ratios
Lab Synthesis
1–5 L reactor synthesis with GPC QC
Pilot Scale-up
50–100 L pilot scale-up with heat-transfer monitoring
Client Testing
Lamination and reflow/reliability evaluation
Mass Production
OEM partner mass production
